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This dry cleaning
system from Tomoe Shokai absorbs vapor and particles using
a high-temperature gas flow instead of vacuum suction,
which is the conventional method for removing waste and
dirt from the process chamber of semiconductor manufacturing
equipment, and expels vapor and particles using the exhaust
system built into the process equipment. |
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Effects |
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Reduces particles and maintains them
at a low level |
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Extends the wet cleaning cycle |
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Reduces chamber recovery time during
wet cleaning |
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Before HGS
Processing |
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Cleaning dirt,
vapor, or other contaminants adhering to the interior
of the chamber is extremely time-consuming, and hitherto
has been achieved by discharging the particles from
the unit using a vacuum pump. |
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During HGS
Processing |
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The concept
of HGS cleaning is to introduce large amounts of
nitrogen or another inert gas into the chamber at
high temperature and high speed to create turbulence,
which, together with the thermal effect, cleans off
vapor, dirt, and other contaminants adhering to the
chamber. Vapor, dirt, and other contaminants are
then absorbed by the adhesive currents of the gas
itself, and are discharged using the exhaust system
of the unit. |
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After HGS Processing |
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HGS processing
has the following effects: (1) Greatly reduces equipment
recovery time (vacuum startup time), (2) Reduces
particles, (3) Increases MWBC by three to four times. |
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Flow Diagram
of the HGS-101 |
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| A great quantity of high-temperature
N2, Ar, or He gas that has been insulated
and compressed is burst-pumped (approx. 300 L per
min.) into the reaction chamber in the process equipment.
As a result, in addition to raising the temperature
within the reaction chamber to between 70°C and
110°C, vapor and particles are absorbed by the
adhesive gas that has been introduced, and are discharged
using the exhaust system built into the process equipment. |
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HGS-101 Utilities |
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Equipment size |
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710 mm (L) x 320 mm (W) x
320 mm (H) |
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Equipment weight |
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54 kg |
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HGS main unit power source |
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AC 200 V, 15 A |
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Control box power source |
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AC 100 V, 10 A |
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Heat mode nitrogen |
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0.5 to 0.7 Mpa, 300 to
450 L/min. |
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Burst mode nitrogen |
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0.5 to 0.7 Mpa, 300 to
450 L/min. |
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Nitrogen for instrumentation
and mechanical seal |
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0.5 to 0.7 Mpa, 5 L/min. |
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Hot
Gas System
